PCB prouction with negative resist, galvanic through hole plating (PTH), green solder mask and blue components printing like Basisline Level 3, but additionally optimized for throughput.

 

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raw material cut to size
(Ne-Cut)

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CNC-drilling and
contour routing
(BUNGARD CCD/ATC)

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brushcleaning
(RBM 300)

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galvanic plating
through hole
(COMPACTA 30 2CU)

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brushcleaning
(RBM 300)

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lamination
of tenting resist
(RLM 419p #1)

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vacuum exposure
(HELLAS)

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spray developing
(SPLASH D)

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spray etching
stripping of tenting resist
(SPLASH CENTER)

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brushcleaning
(RBM 300)

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chemical tinning
(SPLASH CENTER)

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lamination
of solder mask
(RLM 419p #2)

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exposure of solder mask
(HELLAS)

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spray developing
(SPLASH D)

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curing of solder mask
(HELLAS or hot air oven)

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CNC-V-cut or contour routing
(Bungard CCD/ATC)

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System features:

  • CCD/ATC for enhanced drilling, COMPACTA 30 2 CU doubles galvanic throughput, a second laminator RLM 419p avoids changing rolls between the steps!
  • Fine-line technology in industrial quality with green solder mask and blue components printing!
  • (To make components printing repeat again from laminating but with RLM 419p #1 and blue tenting resist)
  • Modular upgradeable to multilayer, artwork production, waste water treatment or surface finishing set at any time !
  • Track resolution: better 150µm!
  • Film production with laser printer or bubble jet or local film supplier.
  • Processing time: approx. 2 hours
  • maximum throughput: 2,0m² / 8h – more than twice the volume of Basisline 3!
  • maximum usable size: 210 x 300 mm