Upgrade Bungard Pick&Place SMT3000 Line 3
Prototypes and small series – Version Eco
Dispensing of solder paste or glue with Print ALL 3000 and Bungard SMD-Stencils
![Image](/images/linien/pick_place_1__692x498.jpg)
![Image](/images/linien/pick_place_3__877x702.jpg)
Component Pick&Place with the Bungard SMT 3000 ECO LIGHT Plus (without dispensing function)
Reflow soldering with the Bungard Reflow Ofen HotAir3000
![Image](/images/linien/pick_place_2__532x399.jpg)
System features:
Max. substrate size: 340 x 170 mm
Max. placement area: 270 x 170 mm
Max. thickness of pcb: 0,5 mm bis ~ 4 mm
Height below pcb: 18mm
Components: Chip 0201 bis QFP 0,65 mm Pitch
Max. component height: ca. 20 mm
Pre-heat temperature: 60-260°C
Reflow time: 0-999 Sekunden
Reflow temperature: 90-300°C