Flow Chart Multilayer complete

Preparation part 1
artwork production

precut films
(Ne-Cut)

insert film
(Filmstar)

convert and arrange
Gerberdatas to Bitmap
(PC)

start photoplotter
(Filmstar)

develop, fix, rinse and dry film
(dark room)

control film
(light table)

cut films to size
(Ne-Cut)

Film

Preparation part 2
Inner layers

Cut raw material to size
(Ne-Cut)

CNC-drilling of reference holes
on innerlayers, prepregs +
top/bottom layers
(BUNGARD CCD)

brushcleaning of inner layers
(RBM 402KF/RBM 300)

laminating of etch resist
(RLM 419p)

vacuumexposure
(EXP 8000/HELLAS)

spraydeveloping
(DL500/SPLASH)

sprayetching
(DL 500/SPLASH CENTER)

stripping of etchresist
(DL 500S/SPLASH CENTER)

brushcleaning
(RBM 402KF/RBM 300)

insert reference pins
(Favorit)

mulitlayer press lamination
(RMP 210)

PCB standard process
incl. PTH

CNC-drilling
(BUNGARD CCD)

brushcleaning
(RBM 402KF/RBM 300)

galvanic PTH
(COMPACTA)

brushcleaning
(RBM 402KF/RBM 300)

lamination of etch resist
(RLM 419p)

vacuum exposure
(EXP 8000/HELLAS)

spray developing
(DL 500/SPLASH)

spray etching
(DL 500/SPLASH CENTER)

stripping of etch resist
(DL 500S/SPLASH CENTER)

brush cleaning
(RBM 402KF/RBM 300)

chemical tinning
(EG 01/SPLASH CENTER)

lamination of solder mask
(RLM 419p)

exposure of solder mask
(EXP 8000/HELLAS)

spray developing
(DL 500/SPLASH)

curing of soldermask
(EXP 8000/HELLAS/hot air oven)

CNC-V-cut or CNC-routing
(BUNGARD CCD)

Bungard Elektronik GmbH & Co.KG

Rilkestrasse 1
D-51570 Windeck

+49 2292 / 9 28 28 - 29

We use cookies on our website. Some of them are essential for the operation of the site, while others help us to improve this site and the user experience (tracking cookies). You can decide for yourself whether you want to allow cookies or not. Please note that if you reject them, you may not be able to use all the functionalities of the site.