board size 300 x 400mm
PCB production with negative resist, galvanic through hole plating (PTH), green solder mask and blue components printing like Basisline Level 3, but optimized on throughput
![Image](/images/linien/Comfort_L3_links.jpg)
raw material cut to size
(Ne-Cut)
![Image](/images/linien/necut.jpg)
CNC-drilling and
contour routing
(BUNGARD CCD/ATC)
![Image](/images/linien/ccd2.jpg)
brushcleaning
(RBM 300)
![Image](/images/linien/rbm-300.jpg)
galvanic plating
through hole
(COMPACTA 40 2CU)
![Image](/images/linien/compacta-302cu.jpg)
brushcleaning
(RBM 300)
![Image](/images/linien/rbm-300.jpg)
lamination
of tenting resist
(RLM 419p #1)
![Image](/images/linien/rlm.jpg)
vacuum exposure
(HELLAS)
![Image](/images/linien/hellas.jpg)
spray developing
(SPLASH XL)
![Image](/images/linien/splash-d.jpg)
spray etching
stripping of tenting resist
(SPLASH CENTER XL)
![Image](/images/linien/splash-center.jpg)
brushcleaning
(RBM 300)
![Image](/images/linien/rbm-300.jpg)
chemical tinning
(SPLASH CENTER XL)
![Image](/images/linien/splash-center.jpg)
lamination
of solder mask
(RLM 419p #2)
![Image](/images/linien/rlm.jpg)
exposure of solder mask
(HELLAS)
![Image](/images/linien/hellas.jpg)
spray developing
(SPLASH XL)
![Image](/images/linien/splash-d.jpg)
curing of solder mask
(HELLAS or hot air oven)
![Image](/images/linien/hellas.jpg)
CNC-V-cut or contour routing
(Bungard CCD/ATC)
![Image](/images/linien/ccd2.jpg)
System features:
- CCD/ATC for enhanced drilling, COMPACTA 40 2 CU doubles galvanic throughput, a second laminator RLM 419p avoids changing rolls between the steps!
- maximum usable size: 300 x 400mm because of COMPACTA 40 2CU, SPLASH XL and SPLASH CENTER XL!
- Fine-line technology in industrial quality with green solder mask and blue components printing!
- (To make components printing repeat again from laminating but with RLM 419p #1 and blue tenting resist)
- Modular upgradeable to multilayer, artwork production, waste water treatment or surface finishing set at any time!
- Track resolution: better 150µm!
- Leiterbahnenauflösung: besser als 150μm
- Film production with laser printer or bubble jet or local film supplier.
- Processing time: approx. 2 hours
- maximum throughput: 3,0m² / 8h – approx. three times the volume of Basisline 3!