Upgrade Pick&Place Line 1

Upgrade Bungard Pick&Place SMT 3000 Line 1 Prototypes

Dispensing of solder paste or glue with the Bungard SMT 3000 BASIC or SMT 3000 PLUS
(integrated dispensing function)

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Component Pick&Place with the Bungard SMT 3000 BASIC or SMT 3000 PLUS

Reflow soldering with the Bungard Reflow Oven HotAir06

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System features:

Max. substrate size: 300 mm x 370 mm

Max. placement area: 245 mm x 350 mm

Max. thickness of pcb: 0,5 mm bis ~ 4 mm

Height below pcb: min. 39 mm, max. 50 mm

Components: Chip 0201 bis QFP 0,65 mm Pitch

Max. component height: ca. 16 mm

Pre-heat temperature: 60-260°C

Reflow time: 0-999 Sekunden

Reflow temperature: 90-300°C

Bungard Elektronik GmbH & Co.KG

Rilkestrasse 1
D-51570 Windeck

+49 2292 / 9 28 28 - 29

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