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Isolationline Level 1

PCB production by isolation milling and mechanical through hole plating

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Basisline Level 1

PCB production with mechanical through hole plating

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Basisline Level 2

PCBs like in Level 1 plus green solder mask and blue components printing

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Basisline Level 3

PCBs like in Level 2 in addition with negative resist and galvanic plating through hole

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Comfortline Level 3

PCB production with negative resist, galvanic through hole plating (PTH), green solder mask and blue components printing - like Basisline Level 3, but optimized on through put!

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Comfortline Level 3 XL

PCB production with negative resist, galvanic through hole plating (PTH), green solder mask and blue components printing like Basisline Level 3, but optimized on through put for:

board size 300 x 400mm

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Bungard Profiline Level 3

PCB production with negative resist, galvanic through hole plating (PTH), green solder mask and blue components printing

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Upgrade Multilayer

Production of inner layer and multilayer press lamination

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Flow Chart Multilayer complete

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Bungard Upgrade Artwork Production

Create professional artwork in high resolution, perfect sharpness, complete darkness and most accurate dimensions

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Upgrade Waste Water Treatment 1

IONEX A or B

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Upgrade Waste Water Treatment 2

IONEX KA or KB

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Upgrade Pick&Place Line 1

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Upgrade Pick&Place Line 2