PCBs like in Level 1 - plus green solder mask and blue components printing
additional in Level 2
![Image](/images/linien/Basis_L2_links.jpg)
Original Bungard
positive presensitized boards
![Image](/images/linien/basismaterial.jpg)
CNC-drilling and contour routing
(BUNGARD CCD/2)
![Image](/images/linien/ccd2.jpg)
vacuum exposure
(HELLAS LED)
![Image](/images/2023/06/01/hellas_led.jpg)
dip developing
+ rinsing
+ sprayetching
+ chemical tinning
+ drying
(all in Splash CENTER)
![Image](/images/linien/splash-center.jpg)
mechanical PTH
(FAVORIT)
![Image](/images/linien/favorit.jpg)
lamination
of solder mask
(RLM 419p)
![Image](/images/linien/rlm.jpg)
vacuum exposure of solder mask
(HELLAS LED)
![Image](/images/2023/06/01/hellas_led.jpg)
spraydeveloping
of solder mask
(SPLASH D)
![Image](/images/linien/splash-d.jpg)
curing of solder mask
(HELLAS LED or hot air oven)
![Image](/images/2023/06/01/hellas_led.jpg)
System features:
Like in Level 1, but in addition:
- Laminator for laminating solder mask and SPLASH D for developing (2 additional machines)
- Components printing: repeat Laminating, exposure and developing with blue tenting resist.
- over all process time: 50 to 120min depending on number of holes
- maximum throughput: 6m² / 8 h