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Universally electroplating machine

HitecPlate 2030 + 3040

HitecPlate 2030 and HitecPlate 3040 are universally applicable electroplating machines for the deposition of metals and serve for the production of plated-through-hole printed circuit boards in vertical technology for prototype and small batch production.

The HitecPlate 2030 and HitecPlate 3040 are designed for direct metallization and have baths for process steps cleaning, rinsing, pre-dipping, activating, rinsing, intensifying, rinsing, copper deposition.

Board size:  300x400 (350x450 possible) (3040)

 

Volumen Treatment tanks: ca. 20 l (3040)

 

Volumen Galvanic tank: ca. 60 l (3040)

 

Working height: 900 mm

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The tanks are arranged in series, which leads to a narrow depth and makes later automation possible.

We offer the machine as standard HitecPlate 2030 and HitecPlate 3040 for board sizes of 200 x 300mm² or 300 x 400mm² with a galvanic tank.

Two treatment tanks are equipped with titanium heaters and are thermostatically controlled. The galvanic tanks have an integrated air injection. The cathode bars are driven by a push rod driven again by a DC gear motor. The speed is infinitely adjustable. In addition, a vibration can be retrofitted at any time
The galvanic tank is assigned a continuously variable rectifier. One voltmeter and one ammeter provide information about the electrical values. The particular importance of the flushing is taken into account with a sink behind each treatment bath. These can be continuously cleaned via an overflow with an AquaPur wastewater system.
The process baths used are based on the proven palladium technology (direct metallization with palladium as catalyst).

 

Techn. Data HitecPlate 2030

Dimensions (LxWxH): 760 x 1350 x 1250 mm

Board size: 200 x 300 mm (250 x 350 mm possible)

Power supply: 230 V AC, 50-60 Hz

Power consumption: 1500 W

Volumen Treatment tanks: approx. 10 l

Volumen Galvanic tank: approx. 30 l

Weight: approx. 130 kg

Working height: 900 mm

Fresh water: 25 mm Spout

Spray rinse connection: 16 mm Spout

Waste water out: 30 mm Spout

Techn. Data HitecPlate 3040

Dimensions (LxWxH): 870 x 1520 x 1250 mm

Board size: 300 x 400 mm (350 x 450 mm possible)

Power supply: 230 V AC, 50-60 Hz

Power consumption: 2000 W

Volumen Treatment tanks: approx. 20 l

Volumen Galvanic tank: approx. 60 l

Weight: approx. 200 kg

Working height: 900 mm

Fresh water: 25 mm Spout

Spray rinse connection: 16 mm Spout

Waste water out: 32 mm Spout

Techn. Data HitecPlate 2030

Dimensions (LxWxH): 760 x 1350 x 1250 mm

Board size: 200 x 300 mm (250 x 350 mm possible)

Power supply: 230 V AC, 50-60 Hz

Power consumption: 1500 W

Volumen Treatment tanks: approx. 10 l

Volumen Galvanic tank: approx. 30 l

Weight: approx. 130 kg

Working height: 900 mm

Fresh water: 25 mm Spout

Spray rinse connection: 16 mm Spout

Waste water out: 30 mm Spout

Techn. Data HitecPlate 3040

Dimensions (LxWxH): 870 x 1520 x 1250 mm

Board size: 300 x 400 mm (350 x 450 mm possible)

Power supply: 230 V AC, 50-60 Hz

Power consumption: 2000 W

Volumen Treatment tanks: approx. 20 l

Volumen Galvanic tank: approx. 60 l

Weight: approx. 200 kg

Working height: 900 mm

Fresh water: 25 mm Spout

Spray rinse connection: 16 mm Spout

Waste water out: 32 mm Spout

Benefits of machine

  • Modular construction
  • Compact design
  • Easy operation, easy handling
  • Clean work flow
  • Uniform deposition of copper on the surface and the drill hole
  • Automatic rinse water exchange possible

Available accessories and optional changes

  • Safety tray
  • exhaust hood
  • Vibration motor
  • Set of Anodes
  • chemicals
  • PCB holder
  • Filters for galvanic baths
  • Ion exchange equipment for rinsing
  • Change the size of the pool according to the required working surface 

Construction of machine (basic module)

  • Machine frame completely made from PVC
  • 5 treatment basin
  • electroplating tanks
  • separate rinsing section for every process step
  • Automatic rinse water exchange possible
  • anode frame
  • Drain valve and cover for each basin
  • Air injection for copper bath
  • Agitation on all tanks, infinitely adjustable
  • 2 Titanium heater
  • main switch
  • Electronic rectifier, current or voltage constant mode

Optional extensions processes

Because of the modular structure the following additional processes can be integrated into the equipment:

  • Tinning (subtractive technology)
  • Desmear, Blackening
  • Immersion Tin
  • Organic protective layer (OSP)
  • Electroless nickel / gold or
  • Stripper negative resist

Through-hole plating

All specifications are subject to change without notice.