SPLASH CENTER | Bungard Elektronik - Spray etching machine

Spray etching machine

Splash Center/Splash Center XL

Laboratory etching machine with static and spray rinse, integrated developer tank, a reserve tank for e.g. chemical tinning and a squeeze dryer. The Splash-Center is suitable for double-sided PCBs. Special emphasis was put on ergonomical and clean etching and rinsing as well as on low chemical drag out.
A typical workflow for example is to use tank 1 (spray compartment) for etching, tank 2 and 3 for rinsing, tank 4 (with centrifugal pump) for developing and tank 5 for tinning.

Power supply: 230 V~, 50 Hz, approx. 1,5 kW (XL)

 

Dimensions (LxWxH): 1160 x 770 x 1200 mm (XL)

 

Etchingformat: 300 x 400 mm (XL)

 

Tank capacity: 1 x 35 L + 1 x 22 L + 3 x 15 L (XL)

Etching compartment

  • Maintenance free etching system with solid stream nozzles
  • Etching speed of 35 µm Cu within 90 seconds (warm Fe-III-Cl).
  • Big window to the etching chamber made from transparent PVC.
  • Maximum board size: 210 x 300 mm /Splash-Center XL: 300 x 400
  • Line resolution better than 0.1 mm (100 µm)
  • Suitable for all common etchants. Fe-III-Cl recommended
  • Lid to the etching chamber with safety switch
  • Removable board holder made from Titanium and PVC. Can be locked in drip-off position
  • Easy access to the etching chamber.
  • Strong 1000 W Quarz heater, etching temperature controlled by thermostat
  • Overheat fuse
  • Digital timer with count down, auto reset and beeper
  • Integrated rinsing zone with drip off holder.
  • 5 ball valves for all tanks
  • Suitable for spray developing

Developer and rinse compartment

  • Magnetic centrifugal pump to revolve developer
  • two integrated static rinses, one can be used for neutralization purposes
  • Fresh water spray zone activated by foot switch, including splash protection
  • A reserve tank, e.g. for immersion tin

Splash Center

Power supply: 220 V~, 50 Hz, approx. 1,5 kW

Dimensions (LxWxH): 1000 x 670 x 1200 mm

Working Level: 900 mm

Etchingformat: 210 x 300 mm

Tank capacity: 1 x 23 L + 1 x 12 L + 3 x 8 L

Weight: approx. 46 kg

Features

  • 5 ball valves to drain all tanks, cover protected from the front side.
  • All tanks with lids
  • Integrated drip tray for all tanks, sure-footed about 120 mm above the ground
  • Integrated mechanical squeeze dryer

Splash Center XL

Power supply: 220 V~, 50 Hz, approx. 1,5 kW

Dimensions (LxWxH): 1160 x 770 x 1200 mm

Working Level: 900 mm

Etchingformat: 300 x 400 mm

Tank capacity: 1 x 35 L + 1 x 22 L + 3 x 15 L

Weight: approx. 56 kg

Etching compartment
  • Maintenance free etching system with solid stream nozzles
  • Etching speed of 35 µm Cu within 90 seconds (warm Fe-III-Cl).
  • Big window to the etching chamber made from transparent PVC.
  • Maximum board size: 210 x 300 mm /Splash-Center XL: 300 x 400
  • Line resolution better than 0.1 mm (100 µm)
  • Suitable for all common etchants. Fe-III-Cl recommended
  • Lid to the etching chamber with safety switch
  • Removable board holder made from Titanium and PVC. Can be locked in drip-off position
  • Easy access to the etching chamber.
  • Strong 1000 W Quarz heater, etching temperature controlled by thermostat
  • Overheat fuse
  • Digital timer with count down, auto reset and beeper
  • Integrated rinsing zone with drip off holder.
  • 3 cog valves for all tanks
  • Suitable for spray developing

 

 

Developer and rinse compartment
  • Magnetic centrifugal pump to revolve developer
  • two integrated static rinses, one can be used for neutralization purposes
  • Fresh water spray zone activated by foot switch, including splash protection
  • A reserve tank, e.g. for immersion tin
Features
  • 5 ball valves to drain all tanks, cover protected from the front side.
  • All tanks with lids
  • Integrated drip tray for all tanks, sure-footed about 120 mm above the ground
  • Integrated mechanical squeeze dryer
Splash Center

Power supply: 220 V~, 50 Hz, approx. 1,5 kW

Dimensions (LxWxH): 1000 x 670 x 1200 mm

Working Level: 900 mm

Etchingformat: 210 x 300 mm

Tank capacity: 1 x 25 l + 1 x 9 l + 3 x 7 l

Weight: approx. 46 kg

Splash Center XL

Power supply: 220 V~, 50 Hz, approx. 1,5 kW

Dimensions (LxWxH): 1160 x 770 x 1200 mm

Working Level: 900 mm

Etchingformat: 300 x 400 mm

Tank capacity: 1 x 40 l + 1 x 24 l + 3 x 15 l

Weight: approx. 56 kg

Etching / developing machines

All specifications are subject to change without notice.

Bungard Elektronik GmbH & Co.KG

Rilkestrasse 1
D-51570 Windeck

+49 2292 / 9 28 28 - 29

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