SPLASH | Bungard Elektronik - Spray etching machine

Spray etching machine

Splash/Splash XL

Spray etching machine for laboratory use with integrated static rinse. Machine is suitable for double sided material. Special emphasis was put on ergonomical and clean etching and rinsing as well as on low chemical drag out.

Power supply:: 230 V~, 50 Hz, approx. 1,5 kW (XL)


Dimensions (LxWxH): 800 x 650 x 1200 mm (XL)


Tank capacity: approx. 35 L (XL)


Weight: approx. 40 kg (XL)

Features

  • Maintenance free system with self-cleaning nozzles and magnetic pump
  • Etching speed of 35 μm Cu within 90 seconds (warm Fe-III-Cl).
  • Big window to the etching chamber made from transparent PVC.
  • Maximum board size: 210 x 300 mm. (Splash XL: 300 x 400 mm)
  • Line resolution better than 0.1 mm (100 μm)
  • Suitable for all common etchants
  • Lid to the etching chamber with safety switch
  • Removable board holder made from Titanium and PVC. Can be locked in drip-off position
  • Easy access to the etching chamber.
  • Strong 1000 W Quarz heater, controlled by thermostat
  • Overheat fuse
  • Digital timer with count down, auto reset and beeper.
  • Integrated rinsing zone with drip off holder.
  • 3 cog valves for all tanks
  • Suitable for spray developing

Splash

Power supply: 230 V~, 50 Hz, approx. 1,5 kW

Dimensions (LxWxH): 600 x 660 x 1200 mm

Tank capacity: approx. 23 L

Weight: approx. 35 kg

Working Level: 900 mm

Etchingformat: 210 x 300 mm

Splash XL

Power supply: 230 V~, 50 Hz, approx. 1,5 kW

Dimensions (LxWxH): 800 x 650 x 1200 mm

Tank capacity: approx. 35 L

Weight: approx. 40 kg

Working Level: 900 mm

Etchingformat: 300 x 400 mm

Features
  • Maintenance free system with self-cleaning nozzles and magnetic pump
  • Etching speed of 35 μm Cu within 90 seconds (warm Fe-III-Cl).
  • Big window to the etching chamber made from transparent PVC.
  • Maximum board size: 210 x 300 mm. (Splash XL: 300 x 400 mm)
  • Line resolution better than 0.1 mm (100 μm)
  • Suitable for all common etchants
  • Lid to the etching chamber with safety switch
  • Removable board holder made from Titanium and PVC. Can be locked in drip-off position
  • Easy access to the etching chamber.
  • Strong 1000 W Quarz heater, controlled by thermostat
  • Overheat fuse
  • Digital timer with count down, auto reset and beeper.
  • Integrated rinsing zone with drip off holder.
  • 3 cog valves for all tanks
  • Suitable for spray developing
Splash

Power supply: 230 V~, 50 Hz, approx. 1,5 kW

Dimensions (LxWxH): 600 x 660 x 1200 mm

Tank capacity: approx. 25 l

Weight: approx. 35 kg

Working Level: 900 mm

Etchingformat: 210 x 300 mm

Splash XL

Power supply: 230 V~, 50 Hz, approx. 1,5 kW

Dimensions (LxWxH): 800 x 650 x 1200 mm

Tank capacity: approx. 40 l

Weight: approx. 40 kg

Working Level: 900 mm

Etchingformat: 300 x 400 mm

Etching / developing machines

All specifications are subject to change without notice.

Bungard Elektronik GmbH & Co.KG

Rilkestrasse 1
D-51570 Windeck

+49 2292 / 9 28 28 - 29

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