Bungard Laser Direct Imaging (LDI)
The Bungard laser unit is an add-on-item for the Bungard CCD to expose photoresists, solder masks and Alucorex. The laser is mounted into the spindle holder instead of the high frequency spindle and is controlled by the RoutePro 3000 software. The Bungard laser exposure unit is an answer to the demand of many operators for higher precision, faster processing speeds and reduced tool costs, as it is the case for example with isolation milling.
As a result, it is possible to switch from isolation milling to wet processing without the exposure unit and photoplotter.
Please note that this inexpensive add-on gives excellent results for prototypes, but due to its technology, it is much slower than an industrial direct imager.
Converting Gerber to HPGL works best when macros and polygons are avoided when making the Gerber export from your design software.
Laser class: class 3B
Power: 120 mW
Dimensions (LxWxH): 47 x 47 x 110 mm
Line resolution: 50 - 1000 µm / max. 25 - 3000 µm