HotAir 3000 - Quarz Reflow Oven - Bungard Elektronik GmbH & Co.KG

Quarz Reflow Oven

HotAir 3000

The HotAir3000 is a stylish, practical reflow oven for manufacturingand reworking of SMT products.

The oven has a large display. The intuitive menu navigation is controlled by a membrane keyboard.
The product uses highly efficient infrared heating elements and has several thermocouple temperature gauges. Due to this and the precise evaluation in the microprocessor, the temperature curve of the reflow process is highly accurate and the temperature in the respective reflow sections very uniform.
With the HotAir3000 all common alloys can be processed. The oven has an automatic error detection with alarm.
This product has a variety of applications such as reflow soldering, repairing, drying and so on. It is suitable for SMT small series, for research and development of electronic products, school, education and study. The operating system software is in English.
The stove is well insulated by a special aluminum silicate cotton, which reduces energy consumption, protects the circuit and allows optimal operation and keeps the temperature in the furnace constant.

Max. PCB-Board Size: 350 x 300 mm

 

Dimensions (LxWxH): 504 x 500 x 314 mm

 

Heatup Time: approx. 8 min

 

Temperature: 60 - 300°C

Setting Options

5 Phases adjustable in time and temperature:
  • Preheat
  • Heat
  • Soldering
  • Holding
  • Cool down

Working Modi

  • AutomaticReflow-Soldering
  • Permanent Heating or Drying function
  • Option to store 4 different Reflow profiles

Interface

  • Grafic display with Keyboard
  • automatic Alarm function
  • Display of Process progress

Techn. Data

Power connection: 200/230 VAC. / 50-60Hz

Dimensions (LxWxH): 504 x 500 x 314 mm

Power Consumption: max. 2400 W

Max. PCB-Board Size: 350 x 300 mm

Time Settings: 00:00 - 99:59 sec.

Temperature: 60 - 300°C

Heatup Time: approx. 8 min.

Weight: +/- 28 kg

Setting Options
5 Phases adjustable in time and temperature:
  • Preheat
  • Heat
  • Soldering
  • Holding
  • Cool down
Working Modi
  • AutomaticReflow-Soldering
  • Permanent Heating or Drying function
  • Option to store 4 different Reflow profiles
Working Modi
  • Grafic display with Keyboard
  • automatic Alarm function
  • Display of Process progress
Techn. Data

Power connection: 200/230 VAC. / 50-60Hz

Dimensions (LxWxH): 504 x 500 x 314 mm

Power Consumption: max. 2400 W

Max. PCB-Board Size: 350 x 300 mm

Time Settings: 00:00 - 99:59 sec.

Temperature: 60 - 300°C

Heatup Time: approx. 8 min.

Weight: +/- 28 kg

SMT Products