PCBs like in Level 2 - in addition with negative resist and galvanic plating through hole

additional in Level 3

Image

raw material cut to size
(Ne-Cut)

Image

CNC-drilling and
contour routing
(BUNGARD CCD/2)

Image

brushcleaning
(RBM 300)

Image

galvanic plating
through hole

(COMPACTA 30)

Image

brushcleaning
(RBM 300)

Image

lamination
of tenting resist
(RLM 419p)

Image

vacuum exposure
(HELLAS)

Image

spray developing
(SPLASH D)

Image

spray etching
stripping of tenting resist
(SPLASH CENTER)

Image

brushcleaning
(RBM 300)

Image

chemical tinning
(SPLASH CENTER)

Image

lamination
of solder mask
(RLM 419p)

Image

exposure of solder mask
(HELLAS)

Image

spray developing
(SPLASH D)

Image

curing of solder mask
(HELLAS or hot air oven)

Image

CNC-V-cut or contour routing
(Bungard CCD/2)

Image

System features:

  • Fine-line technology in industrial quality with green solder mask and blue components printing!
  • (To make components printing repeat the steps laminating, exposure and developing with blue tenting resist!)
  • Modular upgradeable to multilayer, artwork production, waste water treatment or surface finishing set at any time!
  • Track resolution: better 150µm!
  • Film production with laser printer or bubble jet or local film supplier.
  • Processing time: approx. 2 hours
  • maximum throughput: 0,8m² / 8h
  • maximum usable size: 210 x 300 mm
  • 3 more machines than Level 2: Ne-Cut for board cutting, RBM 300 for cleaning and roughening and COMPACTA 30 for galvanic through hole plating (PTH)