Surfaces

Comparison

Not every surface is equally suitable for every use.

Surface Comparison

Surface Layer / Thickness Application Costs Solderability Storage
Sur Tin 0,8-1,7 μm SN soldering ++ ++ approx. 6 months
Ormecon
chem tin
0,08μm org. metal
0,8-1,2μm SN
soldering, (Conductive Adhesives), press fit technology ++ ++ >12 months
Chem. Nickel
Gold
3-6μmNiP / 70-
120nm Au
soldering, AL-wire bonds, Conductive Adhesives - ++ >12 months
Galv. Gold 4-6NiP / 0,4-
2μm Au
Plugs
Sanders
-- -- unlimited

Comparison Gold Surfaces

Criteria chem. Nickel-Gold (ENIG) chem. Nickel-Thickgold Hardgold
Thickness Gold 0,075-0,3μ 0,5-max 1,0μ 1,0-1,2μ
Thickness Nickel 4-6μ 4-6μ 4-6μ
Storage min. 6 months min. 12 months min. 12 months
Application Alu wire-Bonding Alu wire- or Gold-wire-bonding plugs
Property soft soft hard (Kobalt-alloy)
costs medium medium high
Layouthints none none Gold surfaces must be electrically connected

Surfaces

Bungard Elektronik GmbH & Co.KG

Rilkestrasse 1
D-51570 Windeck

+49 2292 / 9 28 28 - 29

We use cookies on our website. Some of them are essential for the operation of the site, while others help us to improve this site and the user experience (tracking cookies). You can decide for yourself whether you want to allow cookies or not. Please note that if you reject them, you may not be able to use all the functionalities of the site.