Bungard Profiline Level 3

PCB production with negative resist, galvanic through hole plating (PTH), green solder mask and blue components printing

 

Image

raw material cut to size
(Ne-Cut #1)

Image

CNC-drilling and
contour routing
(BUNGARD CCD/ATC #2)

Image

brushcleaning
(RBM 402 KF #3)

Image

galvanic plating
through hole
(COMPACTA 40 2CU #4)

Image

brushcleaning
(RBM 402 KF #3)

Image

lamination
of tenting resist
(RLM 419p #5)

Image

vacuum exposure
(EXP 8000 #6)

Image

spray developing
(DL 500 D #7)

Image

spray etching
(DL 500 #8)

Image

stripping of tenting restist
(DL 500 S #9)

Image

brushcleaning
(RBM 402 KF #3)

Image

lamination
of solder mask
(RLM 419p #10)

Image

exposure of solder mask
(EXP 8000 #6)

Image

spray developing
(DL 500 D #7)

Image

curing of solder mask
(EXP 8000 #6)

Image

CNC-V-cut or contour routing
(Bungard CCD/ATC #2)

Image

System features:

  • Fine-line technology in industrial quality with green solder mask and blue components printing!
  • (To make components printing repeat again from laminating but with RLM 419p #1 and blue tenting resist)
  • Modular upgradeable to multilayer set, artwork production, waste water treatment or surface finishing at any time !
  • Track resolution: better 150µm!
  • Film production with laser printer or bubble jet or local film supplier.
  • Processing time: approx. 1,5 hours!
  • maximales Plattenformat: 300 x 400 mm !
  • maximum throughput: 4,5m² / 8h!
  • maximum usable size: 300 x 400mm!
Bungard Elektronik GmbH & Co.KG

Rilkestrasse 1
D-51570 Windeck

+49 2292 / 9 28 28 - 29

We use cookies on our website. Some of them are essential for the operation of the site, while others help us to improve this site and the user experience (tracking cookies). You can decide for yourself whether you want to allow cookies or not. Please note that if you reject them, you may not be able to use all the functionalities of the site.