ORMECON® chemical tin
Ormecon immersion tin is a method for chemical tin plating of copper surfaces.
The special on Ormecon process is a 0.08 micron thick layer of organic metal, which optimally prepares the surface for subsequent tinning and then prevents the 'diffusion of copper through the tin.
Ormecon ® CSN meets all modern requirements for PCBs.
layer thickness: 0,8 – 1,2 μm
storage time : 12 Monate
solderability: 6 Monate