Chemical tinning

ORMECON® chemical tin

Ormecon immersion tin is a method for chemical tin plating of copper surfaces.
The special on Ormecon process is a 0.08 micron thick layer of organic metal, which optimally prepares the surface for subsequent tinning and then prevents the 'diffusion of copper through the tin.

Ormecon ® CSN meets all modern requirements for PCBs.

layer thickness: 0,8 – 1,2 μm

 

storage time : 12 Monate

 

solderability: 6 Monate

 

Attributes

  • completely planar surfaces for SMD technology
  • high storage capacity of bare printed circuit board
  • Energy and cost savings compared to HASL
  • can be used in basket systems without a major investment
  • suitable for horizontal production lines
  • protects the environment
  • simple process control and monitoring
  • all common solder and assembly print varnishes are processed

Equipment

PROTEC 2030
PROTEC is ideally suited to the Ormecon chemical tinning procedure. The standard machine can process plates up to 200 x 300mm and contains 5 pools for Microetch, combined spray- and static rinse, Organic metal, chemical tinning 7001, hot rinse

Advantages

  • Deposition of pure tin
  • Up to 50% longer service life of the tin bath
  • significant reduction of the diffusion layer
  • protection against oxidation • mulitiple, including interim storage, possible
  • Rating: 4 hours ageing 155 ° C, 3 x reflow, 1 x Shaft

Additional Options

Plate size 300 x 400mm
Bath movement
Pools for Cleaning Step
Pool for DI rinse

Schichteigenschaften
  • Schichtdicke 0,8 – 1,2 μm
  • Geeignet für bleifreies Löten
  • nicht geeignet für Mehrfachlötungen
  • Lagerzeit 12 Monate, Lötfähigkeit 6 Monate
  • kann jederzeit neu verzinnt werden
  • Gute Planarität für SMT-Anwendungen
  • Geeignet für FineLine
  • Geeignet für complinat pin (press-fit) Verbindungen
  • Preisgünstiges Verfahren
Lieferumfang
SUR-TIN Teil 1, Teil 2 und Teil 3

Surfaces