Consumables
Bungard Cotherm®
Base plate: 1 - 2 mm Aluminium
Insulating layer: 0,1 mm (FR4)
ED Copper foil: 0,035 mm
Base plate: 1 - 2 mm Aluminium
Insulating layer: 0,1 mm (FR4)
ED Copper foil: 0,035 mm
COTHERM® is an insulated metal substrate, consisting of three layers: a base plate made of 1000-2000μm aluminum at the bottom and a 35μm thick ED copper foil on the upper side. Between the two layers there is an electrically isolating layer (FR4) in 100μm thickness, consisting of glass fabric combined with a mixture from epoxy resin and ceramic(s). This layer guarantees a very good thermal conduction, a high dielectric strength and a continuous high temperature resistance. The aluminum base plate is provided with a foil that protects the aluminum during the wet processes of the printed circuit board manufacturing process, in order to prevent a contact bridge between the aluminum and copper.
The metal core boards Cotherm® can be supplied with or without a photo layer. The processing is done in the same manner as in Bungard presensitized base material. There is only only difference: The aluminum must be covered when developing or etching the board, in order to prevent contact between the aluminum and the developer or etchant.
COTHERM® is an insulated metal substrate, consisting of three layers: a base plate made of 1000-2000μm aluminum at the bottom and a 35μm thick ED copper foil on the upper side. Between the two layers there is an electrically isolating layer (FR4) in 100μm thickness, consisting of glass fabric combined with a mixture from epoxy resin and ceramic(s). This layer guarantees a very good thermal conduction, a high dielectric strength and a continuous high temperature resistance. The aluminum base plate is provided with a foil that protects the aluminum during the wet processes of the printed circuit board manufacturing process, in order to prevent a contact bridge between the aluminum and copper.
The metal core boards Cotherm® can be supplied with or without a photo layer. The processing is done in the same manner as in Bungard presensitized base material. There is only only difference: The aluminum must be covered when developing or etching the board, in order to prevent contact between the aluminum and the developer or etchant.
Rilkestrasse 1
D-51570 Windeck
+49 2292 / 9 28 28 - 29