Bungard Pick&Place SMT3000
ORIGINAL BUNGARD Presensitized Boards
Bungard LDI, UV laser direct imaging system for all common types of photoresists.
PROFILINE: PCB production with negative resist, galvanic through hole plating (PTH), green solder mask and blue components printing

That is not possible for sure. The inner layers of such a board are too thin (0.2mm). They will be destroyed by the penetration of the isolation milling tool. The air inclusions in the milling channels will cause delamination of the layers under the smallest thermal stress, i. e. during soldering. Why else has this technique never found any acceptance in industry?

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