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FR Upgrade Bungard Pick&Place SMT 3000 Line 1 Prototypes
Dispensing of solder paste or glue with the Bungard SMT 3000 BASIC or SMT 3000 PLUS
(integrated dispensing function)
Component Pick&Place with the Bungard SMT 3000 BASIC or SMT 3000 PLUS
Reflow soldering with the Bungard Reflow Oven HotAir06
System features:
Max. substrate size: 300 mm x 370 mm
Max. placement area: 245 mm x 350 mm
Max. thickness of pcb: 0,5 mm bis ~ 4 mm
Height below pcb: min. 39 mm, max. 50 mm
Components: Chip 0201 bis QFP 0,65 mm Pitch
Max. component height: ca. 16 mm
Pre-heat temperature: 60-260°C
Reflow time: 0-999 Sekunden
Reflow temperature: 90-300°C
