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FR board size 300 x 400mm
PCB production with negative resist, galvanic through hole plating (PTH), green solder mask and blue components printing like Basisline Level 3, but optimized on throughput
raw material cut to size
(Ne-Cut)
CNC-drilling and
contour routing
(BUNGARD CCD/ATC)
brushcleaning
(RBM 300)
galvanic plating
through hole
(COMPACTA 40 2CU)
brushcleaning
(RBM 300)
lamination
of tenting resist
(RLM 419p #1)
vacuum exposure
(HELLAS)
spray developing
(SPLASH XL)
spray etching
stripping of tenting resist
(SPLASH CENTER XL)
brushcleaning
(RBM 300)
chemical tinning
(SPLASH CENTER XL)
lamination
of solder mask
(RLM 419p #2)
exposure of solder mask
(HELLAS)
spray developing
(SPLASH XL)
curing of solder mask
(HELLAS or hot air oven)
CNC-V-cut or contour routing
(Bungard CCD/ATC)
System features:
- CCD/ATC for enhanced drilling, COMPACTA 40 2 CU doubles galvanic throughput, a second laminator RLM 419p avoids changing rolls between the steps!
- maximum usable size: 300 x 400mm because of COMPACTA 40 2CU, SPLASH XL and SPLASH CENTER XL!
- Fine-line technology in industrial quality with green solder mask and blue components printing!
- (To make components printing repeat again from laminating but with RLM 419p #1 and blue tenting resist)
- Modular upgradeable to multilayer, artwork production, waste water treatment or surface finishing set at any time!
- Track resolution: better 150µm!
- Leiterbahnenauflösung: besser als 150μm
- Film production with laser printer or bubble jet or local film supplier.
- Processing time: approx. 2 hours
- maximum throughput: 3,0m² / 8h – approx. three times the volume of Basisline 3!
